20240820
Yesterday, ESMC—TSMC's joint venture with Bosch, Infineon Technologies, and NXP Semiconductors—held a groundbreaking ceremony to officially mark the initial phase of land preparation for its first semiconductor fab in Dresden, Saxony, Germany. The event brought together government officials, customers, suppliers, business partners, and academia to celebrate a milestone in the establishment of the EU's first FinFET-capable pure-play foundry.
🔹 Distinguished guests included European Commission President Ursula von der Leyen, German Chancellor Olaf Scholz, Saxony Minister President Michael Kretschmer, and Lord Mayor of Dresden Dirk Hilbert.
🔹 During the event, President von der Leyen announced that the European Commission has approved, under EU State aid rules, a €5 billion German measure to support ESMC in the construction and operation of the semiconductor fab.